Vol. 1, Issue 12, Part M (2015)

Abstract
This paper aims at developing a defect detection algorithm for semiconductor IC package by image analysis of a single captured image, without reference to another image during inspection. The integrated(IC) pattern is usually periodic and regular. We propose a method where the defect detection algorithm first segments the captured image into different regions by asset of morphological segmentations with different structuring element sizes. Then a region properties, is calculated for each segmented region. Lastly, the defective region is extracted by the region properties of the image. The experimental results are promising. Future work will focus on variant orientation of a IC package.