International Journal of Applied Research
Vol. 5, Issue 1, Part F (2019)
Study of copper electroplating process for improved rf passive
In this paper portrays a thick copper plating measure dependent on silicon micromachining procedures, for manufacture of high-perspective proportion latent gadgets for high recurrence applications. Application to twisting inductors is hypothetically explored utilizing the concentric-ring model.
How to cite this article:
Irfan Ahmad Siddique. Study of copper electroplating process for improved rf passive. Int J Appl Res 2019;5(1):530-532.