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ISSN Print: 2394-7500, ISSN Online: 2394-5869, CODEN: IJARPF

International Journal of Applied Research

Vol. 5, Issue 1, Part F (2019)

Study of copper electroplating process for improved rf passive

Author(s)
Irfan Ahmad Siddique
Abstract
In this paper portrays a thick copper plating measure dependent on silicon micromachining procedures, for manufacture of high-perspective proportion latent gadgets for high recurrence applications. Application to twisting inductors is hypothetically explored utilizing the concentric-ring model.
Pages: 530-532  |  35 Views  6 Downloads
How to cite this article:
Irfan Ahmad Siddique. Study of copper electroplating process for improved rf passive. Int J Appl Res 2019;5(1):530-532.
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