Contact: +91-9711224068
International Journal of Applied Research
  • Multidisciplinary Journal
  • Printed Journal
  • Indexed Journal
  • Refereed Journal
  • Peer Reviewed Journal

ISSN Print: 2394-7500, ISSN Online: 2394-5869, CODEN: IJARPF

IMPACT FACTOR (RJIF): 8.4

Vol. 5, Issue 1, Part F (2019)

Study of copper electroplating process for improved rf passive

Study of copper electroplating process for improved rf passive

Author(s)
Irfan Ahmad Siddique
Abstract
In this paper portrays a thick copper plating measure dependent on silicon micromachining procedures, for manufacture of high-perspective proportion latent gadgets for high recurrence applications. Application to twisting inductors is hypothetically explored utilizing the concentric-ring model.
Pages: 530-532  |  479 Views  55 Downloads
How to cite this article:
Irfan Ahmad Siddique. Study of copper electroplating process for improved rf passive. Int J Appl Res 2019;5(1):530-532.
Call for book chapter
International Journal of Applied Research
Journals List Click Here Research Journals Research Journals