Vol. 8, Issue 2, Part H (2022)
To evaluate the efficacy of Dashangsunthi Lepa in management of Shotha and Shula in case of Asthibhagna
To evaluate the efficacy of Dashangsunthi Lepa in management of Shotha and Shula in case of Asthibhagna
Author(s)
Dr. Shweta Santosh Naik and Dr. Basil Cardozo
Abstract
Sandhi Shotha and Shula are widely observed symptoms in many diseases like Aamvata, Vatarakta Avabhahuka, Vatakantaka, Sandhigatavata, Aghatajanya Shotha etc. Sushruta Samhita Sutrasthan in Vranalepab and avidhiadhyaya before bandha it is given prime importance in Vranachikitsa [1]. Lepa is one of the treatment modalities available for the treatment of Sandhi Shotha and Shula among many others. As Lepa is inexpensive, easy to apply and does not need to be consumed and rapid in action it was taken up for the present study. Present study is aimed at proving that Sandhi Shotha and Shula arising in Asthibhagna can be effectively treated with Bhirparimarja chikitsa ie. Lepa Kalpana. In the specific treatment of bhagna, lepa is explained as the treatment purpose. The lepa used is Dashang Sunthi lepa which is Shothagana and Shulagna in action and therefore helpful in reducing Shotha and Shula caused by Aghata in Asthibhagna. The Vata dosha which has been vitiated on account of injury causes Rakta, Pitta, Kapha to proceed towards bahisiraas there is rupture of this Sira which rupture and causes this Rakta, Pitta, Kapha to accumulate within the muscles and among the layer of the skin leading to swelling around the fracture tissue. This elevation is referred as Aghatjanya Shotha. The constituents of Dashang Sunthi viz. Daruharidra, Haridra, Raktachandhan have anti-inflammatory which helps in reducing Shotha and Shula. Sunthi is Vatakaphagna properties causes Vedanashaman and therefore Dashang Sunthi was selected for the treatment of Asthibhagna.
How to cite this article:
Dr. Shweta Santosh Naik, Dr. Basil Cardozo. To evaluate the efficacy of Dashangsunthi Lepa in management of Shotha and Shula in case of Asthibhagna . Int J Appl Res 2022;8(2):549-553.